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36
MetalBase

Last Loaded on Web: Monday, April 01, 2013

Last Update To Bluesheet: October 13, 2005

Bluesheet Contents     PDF version

File Description Print Counterparts Geographic Coverage Terms and Conditions Limit Rates
Subject Coverage Dialog File Data Special Features Sample Record Sort
Sources Database Content DIALINDEX/OneSearch Categories Basic Index Rank
Tips Document Types Indexed Contact Additional Indexes Predefined Format Options


File Description [top]

MetalBase provides comprehensive coverage of international metals literature. The file includes references and abstracts for hundreds of technical journals, technical reports, conference papers, reviews, books, and patents.



Tips [top]

USE FILE 36

to search the global literature on the metals and allied processes.

SEARCH DESCRIPTORS

to find highly relevant records:

     S REFRACTIVE INDEX/DE

USE RANK

to find experts working in an area of interest:

     SELECT INDUSTRIAL GASES
      RANK AU

USE FS=

to search one of the subfiles:

     SELECT FS=INSPEC      SELECT FS=PASCAL

USE /ENG LIMIT

to limit a search to articles in English:

     SELECT S3/ENG



Subject Coverage [top]

All specialized metals topics are covered including: forms, materials, products, processes, and properties. In addition, all topics relating to welding and allied processes are covered, including:

  • Brazing and Corrosion
  • Diffusion bonding
  • Equipment for joining and cutting processes
  • Fatigue and fracture mechanics
  • Hardfacing and Microjoining
  • Non-destructive testing
  • Soldering and Surfacing
  • Thermal cutting
  • Thermal spraying
  • Welding


Sources [top]

MetalBase is drawn from all metals categories covered in:

  • INSPEC, Dialog File 2
  • Weldasearch, Dialog File 25
  • Pascal, Dialog File 144
  • Current Contents, Dialog File 440

Search fields common to all files are available to search metals topics in this database.



Print Counterparts [top]

  • Welding Abstracts


Dialog File Data [top]

Dates Covered: 1966 to the present
File Size: 314,610 records as of June 2004
Update Frequency: Weekly (Monthly for WeldaSearch records)


Database Content [top]

  • Bibliographic Records


Document Types Indexed [top]

  • Reports
  • Books and Monographs
  • Conferences, Symposia, Meetings
  • Journal Articles
  • Patents


Geographic Coverage [top]

  • International


Geographic Restrictions [top]

  • None


Special Features [top]


DialIndex/OneSearch Categories [top]

ACRONYM CATEGORY NAME
AUTO Automotive Research
CERAMICS Ceramics and Composites
COMPOSIT Ceramics and Composites
EECOMP Electrical Engineering
ELECTRON Computers, Electronics, and Telecommunications Business
ENG Engineering
MATERIAL Materials
METALS Metals
MINING Mining
SCITECH Science and Technology


Contact [top]

MetalBase is produced by Dialog. Questions concerning database content should be directed to:

Dialog LLC
The Knowledge Center
2250 Perimeter Park Drive
Suite 300

Morrisville, NC 27560
USA
Telephone: 919.804.6400
800 Line: 1-800-3DIALOG
Fax: 919.804.6410
E-Mail: customer@dialog.com


Terms and Conditions [top]

Weldasearch® is a registered trademark of TWI Ltd.

For Dialog's Redistribution and Archive Policy, enter HELP ERA online. The following terms and conditions also apply.

The Weldasearch® database is copyrighted by TWI Ltd. All rights reserved.

Weldasearch® abstracts are intended to represent the contents of the original publications. All reasonable care is taken in abstracting and editing, but TWI Ltd can n ot accept any liability in respect of any error or omission, or of any views expressed, which are those of the original authors, not of TWI.

You may download, copy and use Weldasearch® records personally or pass results of a search to an individual within your own organisation. For distribution outside your organisation a separate agreement is required with TWI Ltd.


Dialog Standard Terms & Conditions apply.


SAMPLE RECORD [top]

WELDASEARCH SAMPLE RECORD

     
    DIALOG(R)File  25:Weldasearch 
    (c) 2004 TWI Ltd. All rts. reserv. 
     
  AA=  00221071 200614 
  /TI  Five - fold   branched   Si  [silicon] particles in laser clad AlSi 
    [aluminium alloy] functionally graded materials. 
  AU=  PEI Y T; HOSSON J T M de 
  CS=  UNIVERSITY OF GRONINGEN 
  JN=,SO=  Acta Materialia, vol.49, no.4. 23 Feb.2001. pp.561-571. 9 fig., 2 tab., 19 
    ref. 
  PU=  ACTA MATERIALIA 
  PY=, DT=  PUBLICATION DATE: 20010000    DOCUMENT TYPE: Journal 
  LA=, RT=  LANGUAGE: English    RECORD TYPE: Abstract 
     
  /AB  The results of microstructural investigations on the five-fold twinning and 
    growth features of large Si particles, in Al-40%Si functionally graded 
    materials produced by a Nd:YAG laser surfacing process on cast Al alloy 
    substrate (Al, 6.3%Si, 4%Cu), are presented. They were obtained from 
    orientation imaging microscopy, TEM and SEM. A model of the groove 
    nucleation followed by the flow of the growth steps over the five ridges 
    for the rapid elongation of the five-fold Si particles is presented. 
    [See also Weldasearch 196829] 
     
  /DE  DESCRIPTORS:  ALUMINIUM ALLOYS; CASTINGS; LASER SURFACING; DEPOSITED METAL; 
    MICROSTRUCTURE; PARTICLES; REFERENCE LISTS; SILICON; LIGHT METALS; 
    SURFACING; CRYSTAL STRUCTURE 
  /ID  IDENTIFIERS:  GRADED MATERIALS 
     


INSPEC SAMPLE RECORD [top]

     
    DIALOG(R)File   2:INSPEC 
    (c) 2004 Institution of Electrical Engineers. All rts. reserv. 
     
  AA=  7893166   INSPEC Abstract Number: A2004-08-7865P-010, B2004-04-7320P-016 
  /TI    High-k  dielectric  stack-ellipsometry  and  electron diffraction 
    measurements of interfacial oxides 
  AU=    Kisik  Choi;  Harris,  H.R.;  Nikishin, S.; Gangopadhyay, S.; 
    Temkin, H. 
  CS=  NanoTECH Center, Texas Tech Univ., Lubbock, TX, USA 
  JN=,SO=,CT=  Conference:  AIP  Conference  Proc (USA) Conference  Characterization  and 
  CL=     Metrology for ULSI Technology. 2003 International Conference, Austin, TX, USA, 
  CY=     14-28 March 2003 
  PU=     Publ: AIP, 2003 
  PY=     AIP Conf. Proceedings  186-9   2003 
  SN=     ISSN: 0094-243X 
  CP=     Country of Publication: USA 
       Refs.:  16 
  DT=     Document Type: Conference Paper (PA); Journal Paper (JP) 
  LA=     Language:  English 
  /AB     Abstract: With the silicon interface becoming increasingly scrutinized in 
    high  dielectric  constant  materials  for  SiO/sub  2/  replacement,  fine 
    distinctions  in the quality of silicon cleaning can have a large impact on 
    MOS  parameters. One of the cleaning schemes that have potential to replace 
    the  industry  standard  RCA  clean  with  HF/H/sub  2/O etch is a modified 
    version  of the Shiraki clean. The evolution of Si (100) surface cleaned by 
    the  modified  Shiraki  method  has  been  investigated  by a conventional, 
    single-wave  length  ellipsometer.  Using  Low  Energy Electron Diffraction 
    (LEED), we have calibrated the ellipsometric measurement for the as-cleaned 
    silicon  surface.  It  was  found  that a lower baseline of 0.7~0.9 nm from 
    ellipsometric  measurements  could be established as equivalent to a clean, 
    hydrogen  passivated surface. To verify the effect of the interfacial oxide 
    thickness on the dielectric constant of the high-k gate stack, thickness of 
    the   thin-oxide  grown  under  high  vacuum  condition  was  measured  and 
    correlated  with  the dielectric constant of the HfO/sub 2/ gate dielectric 
    layer.  (16 Refs) 
     
  /DE    Descriptors: dielectric materials; dielectric thin films; elemental 
    semiconductors; ellipsometry; hafnium compounds; low energy electron 
    diffraction; passivation; permittivity; refractive index; silicon; silicon 
    compounds; surface cleaning 
  /ID    Identifiers: high-k dielectric stack-ellipsometry; electron diffraction; 
    interfacial oxides; silicon interface; dielectric constant; SiO/sub 2/ 
    replacement; silicon cleaning; MOS; HF/H/sub 2/O etch; Shiraki clean; Si 
    (100) surface; conventional single-wave length ellipsometer; low energy 
    electron diffraction; LEED; silicon surface; hydrogen passivated surface; 
    interfacial oxide thickness; high-k gate stack; high vacuum condition; 
    HfO/sub 2/ gate dielectric layer; 0.7 to 0.9 nm; HfO/sub 2/-SiO/sub 2/; Si 
       Copyright 2004, IEE 


BASIC INDEX [top]

SEARCH
SUFFIX		 DISPLAY
CODE		 FIELD NAME
 INDEXING
 SELECT EXAMPLES
None None All Basic Index Fields Word S GRADE(W)MATERIAL?
/AB AB Abstract Word S SILICON(W)INTERFACE/AB
/DE DE Descriptor1 Word
& Phrase		 S DIELECTRIC(W)MATERIAL?/DE
S HAFNIUM COMPOUND?/DE
/ID ID Identifier2 Word
& Phrase		 S ELECTRON(W)DIFFRACT?/ID
S SILICON SURFACE/ID
/TI TI Title Word S ELECTRON(W)DIFFRACTION/TI

1 Also /DF.

2 Also /IF.


ADDITIONAL INDEXES [top]

SEARCH
PREFIX		 DISPLAY
CODE		 FIELD NAME
 INDEXING
 SELECT EXAMPLES
AA= AA IP Accession Number Phrase S AA=A2004-08-7865P-010
AD= AD Patent Application Date Phrase S AD=20000118
AU= AU Author Phrase S AU=HARRIS, H?
None AV Availability
None AZ DIALOG Accession Number
None AZ Dialog Accession Number
BN= BN International Standard Book Number (ISBN) Phrase S BN=0 7803 7815 6
CL= CL Conference Location Word S CL=(AUSTIN(W)TX)
CP= CP Country of Publication Phrase S CP=USA
CS= CS Corporate Source Word
& Phrase		 S CS=(NANOTECH(W)CENTER)
S CS=UNIV. CARLOS?
CT= CT Conference Title Word S CT=(ULSI(W)TECHNOLOGY)
CY= CY Conference Year Phrase S CY=2003
DT= DT Document Type Phrase S DT=CONFERENCE PAPER
FS= FS File Segment Phrase S FS=INSPEC
JN= JN Journal Name Phrase S JN=ACTA MATERIALIA
LA= LA Language Phrase S LA=ENGLISH
PC= PC Patent Country Phrase S PC=EP
PI= PI Patent Issue Date Phrase S PI=20000726
PN= PN Patent/Application Number Phrase S PN=EP 1022084
PU= PU Publisher Phrase S PU=AIP?
PY= PY Publication Year Phrase S PY=2003
RN= RN Report/Contract/Document Number Word
& Phrase		 S RN=207X
S RN=S0042- 207X (02)00536-5
S RN=S0042207X(02)005365
RT= RT Record Type Phrase S RT=ABSTRACT
SN= SN International Standard Serial Number (ISSN) Phrase S SN=0094-243X
S SN=0094243X
SO= SO Source Information Word S SO=(ACTA(W)MATERIALIA AND VOL(W)49)
UD= None Update Phrase S UD=9999


LIMIT [top]

SUFFIX FIELD NAME EXAMPLES
/ABS Abstract Present S S1/ABS
/ENG English Language S S2/ENG
/NOABS No Abstracts Present S S5/NOABS
/NONENG Non-English Language S S4/NONENG
/YYYY Publication Year S S9/2001


SORT [top]

SORTABLE FIELDS EXAMPLES
AU, AZ, CS, JN, PY, TI SORT S3/ALL/JN
SORT S5/ALL/PY/D


RANK [top]

RANK FIELDS EXAMPLES
All phrase- and numeric-indexed fields in the Additional Indexes can be ranked. Other RANK codes include: DE, ID RANK DE
RANK AU S4


USER-DEFINED FORMAT OPTIONS [top]

Display codes listed in the Search Options tables can be used to customize output. TYPE S3/AU,TI,SO/1-5
PRINT S2/TI, CS, PY/ALL


PREDEFINED FORMAT OPTIONS [top]

NO.
 DIALOGWEB
FORMAT		 RECORD CONTENT
1 -- DIALOG Accession Number
2 -- Full Record except Abstract
3 Medium Bibliographic Citation
4 -- Full Record with Tagged Fields
5 -- Full Record
6 Short Title and Publication Year
7 Long Full Record except Indexing
8 Free Title, Indexing, and Publication Year
9 Full Full Record
K -- KWIC (Key Word In Context) displays a window of text; may be used alone or with other formats


DIRECT RECORD ACCESS [top]

FIELD NAME EXAMPLES
If the accession number of a specific record is known, it can be used to display the record directly. TYPE 221795/5
DISPLAY 220326/AU,TI
PRINT 220796/9


Rates [top]

Rates For File: MetalBase[36]
Cost per DialUnit:                $11.00
Cost per minute:                   $2.73
Rank Elements                      $0.00
ALERT (default)                   $11.00
ALERT (Monthly)                   $11.00
ALERT (Biweekly/twice a month) *  $11.00
ALERT (Weekly)                    $11.00
ALERT (Daily)                  *  $11.00
ALERT (Calendar weekly)        *  $11.00
ALERT (Intraday)               *  $11.00
* = custom scheduled Alerts only
ALERT Number of included prints        0

Format    Types   Prints
     1    $0.00    $0.00
     2    $5.00    $5.00
     3    $3.50    $3.50
     4    $5.00    $5.00
     5    $5.00    $5.00
     6    $0.00    $0.00
     7    $5.00    $5.00
     8    $0.00    $0.00
     9    $5.00    $5.00
KWIC95    $0.33       NA
KWIC96    $0.33       NA

REDIST/COPY Multiplier Table:

      Range      Multiplier
        1-2       1.00
       3-25       1.50
     26-100       3.00
    101-200       4.00
    201-500       6.00
   501-1000       8.00
 1001 or more    10.00

ARCHIVE Multiplier Table:

      Range      Multiplier
       1-25       1.50
     26-200       3.00
    201-500       6.00
   501-1000       8.00
 1001 or more    10.00
[top]


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